Avenas, Yvan: search on Z-Library

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1

[IEEE 2011 IEEE Energy Conversion Congress and Exposition (ECCE) - Phoenix, AZ, USA (2011.09.17-2011.09.22)] 2011 IEEE Energy Conversion Congress and Exposition - Study and realization of a high power density electronics device cooling loop using a liquid metal coolant

Tawk, Mansour, Avenas, Yvan, Kedous-Lebouc, Afef, Petit, Mickael

Year:

2011

Language:

english

File:

PDF, 744 KB

english, 2011

2

Numerical and Experimental Investigations of the Thermal Management of Power Electronics With Liquid Metal Mini-Channel Coolers

Tawk, Mansour, Avenas, Yvan, Kedous-Lebouc, Afef, Petit, Mickael

Journal:

IEEE Transactions on Industry Applications

Year:

2013

Language:

english

File:

PDF, 1.16 MB

english, 2013

3

Comparison of the electro-thermal constraints on SiC MOSFET and Si IGBT power modules in photovoltaic DC/AC inverters

Dbeiss, Mouhannad, Avenas, Yvan, Zara, Henri

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 1.54 MB

english, 2017

4

Power Electronics Cooling of 100 W/cm$^{2}$ Using AC Electroosmotic Pump

Berrouche, Youcef, Avenas, Yvan

Journal:

IEEE Transactions on Power Electronics

Year:

2014

Language:

english

File:

PDF, 630 KB

english, 2014

5

Heat Pipe Integrated in Direct Bonded Copper (DBC) Technology for Cooling of Power Electronics Packaging

Ivanova, Mariya, Avenas, Yvan, Schaeffer, Christian, Dezord, Jean-Bernard, Schulz-Harder, Juergen

Journal:

IEEE Transactions on Power Electronics

Year:

2006

Language:

english

File:

PDF, 1.42 MB

english, 2006

6

[IEEE 2016 IEEE Energy Conversion Congress and Exposition (ECCE) - Milwaukee, WI, USA (2016.9.18-2016.9.22)] 2016 IEEE Energy Conversion Congress and Exposition (ECCE) - Instrumented chip dedicated to semiconductor temperature measurements in power electronic converters

Ka, Ibrahima, Avenas, Yvan, Dupont, Laurent, Vafaei, Raha, Thollin, Benoit, Crebier, Jean-Christophe, Petit, Mickael

Year:

2016

Language:

english

File:

PDF, 1.44 MB

english, 2016

7

[IEEE 2012 IEEE Energy Conversion Congress and Exposition (ECCE) - Raleigh, NC, USA (2012.09.15-2012.09.20)] 2012 IEEE Energy Conversion Congress and Exposition (ECCE) - Fault tolerant 24 KVA interleaved inverter

Jeannin, Pierre-Olivier, Frey, David, Avenas, Yvan, Guepratte, Kevin, Stephan, Herve

Year:

2012

Language:

english

File:

PDF, 1.10 MB

english, 2012

8

[IEEE 2007 IEEE International Symposium on Industrial Electronics - Vigo, Spain (2007.06.4-2007.06.7)] 2007 IEEE International Symposium on Industrial Electronics - Conception and test of flat heat pipe for 3D packaging cooling

Kamenova, Lora, Avenas, Yvan, Popova, Nathaliya, Schaeffer, Christian, Tzanova, Slavka

Year:

2007

Language:

english

File:

PDF, 2.16 MB

english, 2007

9

[IEEE 2018 IEEE Applied Power Electronics Conference and Exposition (APEC) - San Antonio, TX, USA (2018.3.4-2018.3.8)] 2018 IEEE Applied Power Electronics Conference and Exposition (APEC) - Power semiconductor ageing test bench dedicated to photovoltaic applications

Dbeiss, Mouhannad, Avenas, Yvan

Year:

2018

Language:

english

File:

PDF, 2.61 MB

english, 2018

10

An efficient online time-temperature-dependent creep-fatigue rainflow counting algorithm

Samavatian, Vahid, Iman-Eini, Hossein, Avenas, Yvan

Journal:

International Journal of Fatigue

Year:

2018

Language:

english

File:

PDF, 2.55 MB

english, 2018

11

[IEEE 2012 IEEE Energy Conversion Congress and Exposition (ECCE) - Raleigh, NC, USA (2012.09.15-2012.09.20)] 2012 IEEE Energy Conversion Congress and Exposition (ECCE) - Reduction of the stray inductance in a switching cell using the Power Chip-On-Chip 3D integration concept

Marchesini, Jean-Louis, Avenas, Yvan, Jeannin, Pierre-Olivier, Boulahrouz, Salim

Year:

2012

Language:

english

File:

PDF, 994 KB

english, 2012

12

Drift Region Integrated Microchannels for Direct Cooling of Power Electronic Devices: Advantages and Limitations

Vladimirova, Kremena, Crebier, Jean-Christophe, Avenas, Yvan, Schaeffer, Christian

Journal:

IEEE Transactions on Power Electronics

Year:

2013

Language:

english

File:

PDF, 790 KB

english, 2013

13

[IEEE 2014 IEEE Energy Conversion Congress and Exposition (ECCE) - Pittsburgh, PA, USA (2014.9.14-2014.9.18)] 2014 IEEE Energy Conversion Congress and Exposition (ECCE) - Realization and characterization of an IGBT module based on the power chip-on-chip 3D concept

Marchesini, Jean-Louis, Jeannin, Pierre-Olivier, Avenas, Yvan, de Oliveira, Leonardo Ruffeil, Buttay, Cyril, Riva, Raphael

Year:

2014

Language:

english

File:

PDF, 1.95 MB

english, 2014

14

Realization and characterization of instrumented power diode with aluminum RTD sensor – application to thermal impedance evaluation

Ka, Ibrahima, Avenas, Yvan, Dupont, Laurent, Petit, Mickael

Journal:

Year:

2017

Language:

english

File:

PDF, 3.22 MB

english, 2017

15

[IEEE 2012 IEEE Energy Conversion Congress and Exposition (ECCE) - Raleigh, NC, USA (2012.09.15-2012.09.20)] 2012 IEEE Energy Conversion Congress and Exposition (ECCE) - Numerical study of a liquid metal heat spreader for power semiconductor devices

Tawk, Mansour, Avenas, Yvan, Vagnon, Eric, Msaed, Aline

Year:

2012

Language:

english

File:

PDF, 744 KB

english, 2012

16

[IEEE 2014 IEEE Energy Conversion Congress and Exposition (ECCE) - Pittsburgh, PA, USA (2014.9.14-2014.9.18)] 2014 IEEE Energy Conversion Congress and Exposition (ECCE) - Evaluation of thermo-sensitive electrical parameters based on the forward voltage for on-line chip temperature measurements of IGBT devices

Dupont, Laurent, Avenas, Yvan

Year:

2014

Language:

english

File:

PDF, 955 KB

english, 2014

17

[IEEE 2017 IEEE Applied Power Electronics Conference and Exposition (APEC) - Tampa, FL, USA (2017.3.26-2017.3.30)] 2017 IEEE Applied Power Electronics Conference and Exposition (APEC) - Thermal characterization of an IGBT power module with on-die temperature sensors

Bidouche, Badr-El-Boudour, Avenas, Yvan, Essakili, Mouslim, Dupont, Laurent

Year:

2017

Language:

english

File:

PDF, 1.11 MB

english, 2017

18

Effects of Creep Failure Mechanisms on Thermomechanical Reliability of Solder Joints in Power Semiconductors

Samavatian, Vahid, Iman-Eini, Hossein, Avenas, Yvan, Samavatian, Majid

Journal:

IEEE Transactions on Power Electronics

Year:

2020

File:

PDF, 1021 KB

2020

19

Static Sample Magnetometer: A New Characterization Method for Low Permeability Materials and Ferrofluids

Petit, Mickael, Kedous-Lebouc, Afef, Avenas, Yvan, Cherief, Wahid, Rulliere, Elisabeth, Anceau, Baptiste

Journal:

IEEE Transactions on Magnetics

Year:

2014

Language:

english

File:

PDF, 684 KB

english, 2014

20

[IEEE 2011 IEEE Energy Conversion Congress and Exposition (ECCE) - Phoenix, AZ, USA (2011.09.17-2011.09.22)] 2011 IEEE Energy Conversion Congress and Exposition - Drift region integrated microchannel structure for direct cooling of power electronics

Vladimirova, Kremena, Crebier, Jean-Christophe, Avenas, Yvan, Schaeffer, Christian

Year:

2011

Language:

english

File:

PDF, 543 KB

english, 2011

21

Numerical and Experimental Evaluation of the Microsecond Pulsed Heating Curve Technique Dedicated to Die Interconnection Characterization

Thollin, Benoit, Dupont, Laurent, Avenas, Yvan, Crebier, Jean-Christophe, Khatir, Zoubir, Jeannin, Pierre-Olivier

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2016

Language:

english

File:

PDF, 6.32 MB

english, 2016

22

Preliminary Evaluation of Thermo-Sensitive Electrical Parameters Based on the Forward Voltage for Online Chip Temperature Measurements of IGBT Devices

Dupont, Laurent, Avenas, Yvan

Journal:

IEEE Transactions on Industry Applications

Year:

2015

Language:

english

File:

PDF, 1.69 MB

english, 2015

23

Influence of Power Modules on the Thermal Design of Laminated Busbars

Guyot, Dimitri, Avenas, Yvan, Gerlaud, Antoine, de Palma, Jean-François

Journal:

Year:

2018

File:

PDF, 3.03 MB

2018

24

[IEEE 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - Lecco, Italy (2019.9.25-2019.9.27)] 2019 25th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - An Analytical Model for the Optimisation of Metal Foam for Power Electronics Cooling

Glass, Joseph, Avenas, Yvan, Bouvard, Didier, Ferrouillat, Sebastien

Year:

2019

Language:

english

File:

PDF, 4.80 MB

english, 2019

25

[IEEE 2017 19th European Conference on Power Electronics and Applications (EPE'17 ECCE Europe) - Warsaw (2017.9.11-2017.9.14)] 2017 19th European Conference on Power Electronics and Applications (EPE'17 ECCE Europe) - A method for accelerated ageing tests of photovoltaic inverters considering the application's mission profiles

Dbeiss, Mouhannad-G., Avenas, Yvan, Zara, Henri, Dupont, Laurent

Year:

2017

Language:

english

File:

PDF, 1009 KB

english, 2017

26

Reliability Assessment of Multistate Degraded Systems: An Application to Power Electronic Systems

Samavatian, Vahid, Imaneini, Hossein, Avenas, Yvan

Journal:

IEEE Transactions on Power Electronics

Year:

2019

File:

PDF, 1.11 MB

2019

27

Discrete power semiconductor losses vs junction temperature estimation based on thermal impedance curves

TRAN, Do Phuong Uyen, LEFEBVRE, Stephane, AVENAS, Yvan

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2019

Language:

english

File:

PDF, 7.64 MB

english, 2019

28

Integrated temperature sensor with diamond Schottky diodes using a thermosensitive parameter

Perez, Gaëtan, Chicot, Gauthier, Avenas, Yvan, Lefranc, Pierre, Jeannin, Pierre-Olivier, Eon, David, Rouger, Nicolas

Journal:

Diamond and Related Materials

Year:

2017

Language:

english

File:

PDF, 1.11 MB

english, 2017

29

Modeling of power devices with drift region integrated microchannel cooler

Vladimirova, Kremena, Avenas, Yvan, Crebier, Jean-Christophe, Schaeffer, Christian, Lebouc, Fabien, Tawk, Mansour

Journal:

Microelectronics Journal

Year:

2013

Language:

english

File:

PDF, 1.96 MB

english, 2013

30

THE SNOWSTORM : AN ANALYSIS IN LONDON.

Vladimirova, Kremena, Avenas, Yvan, Crebier, Jean-Christophe, Schaeffer, Christian, Lebouc, Fabien, Tawk, Mansour

Journal:

Year:

1909

Language:

english

File:

PDF, 164 KB

english, 1909

31

LIVERPOOL.

Vladimirova, Kremena, Avenas, Yvan, Crebier, Jean-Christophe, Schaeffer, Christian, Lebouc, Fabien, Tawk, Mansour

Journal:

Year:

1902

Language:

english

File:

PDF, 401 KB

english, 1902

32

[IEEE IC's (ISPSD) - San Diego, CA, USA (2011.05.23-2011.05.26)] 2011 IEEE 23rd International Symposium on Power Semiconductor Devices and ICs - Innovative heat removal structure for power devices — The drift region integrated microchannel cooler

Vladimirova, Kremena, Crebier, Jean-Christophe, Avenas, Yvan, Schaeffer, Christian, Litaudon, Stepahne

Year:

2011

Language:

english

File:

PDF, 815 KB

english, 2011

33

Parameters affecting forced convection enhancement in ferrofluid cooling systems

Cherief, Wahid, Avenas, Yvan, Ferrouillat, Sébastien, kedous-Lebouc, Afef, Jossic, Laurent, Petit, Mickael

Journal:

Applied Thermal Engineering

Year:

2017

Language:

english

File:

PDF, 1.08 MB

english, 2017

34

[IEEE 2012 IEEE Applied Power Electronics Conference and Exposition - APEC 2012 - Orlando, FL, USA (2012.02.5-2012.02.9)] 2012 Twenty-Seventh Annual IEEE Applied Power Electronics Conference and Exposition (APEC) - Comparison of junction temperature evaluations in a power IGBT module using an IR camera and three thermo-sensitive electrical parameters

Dupont, Laurent, Avenas, Yvan, Jeannin, Pierre-Olivier

Year:

2012

Language:

english

File:

PDF, 1013 KB

english, 2012

35

PRIMARY CANCER OF THE LIVER.

Vladimirova, Kremena, Avenas, Yvan, Crebier, Jean-Christophe, Schaeffer, Christian, Lebouc, Fabien, Tawk, Mansour

Journal:

Year:

1890

Language:

english

File:

PDF, 182 KB

english, 1890

36

Implementation and Switching Behavior of a PCB-DBC IGBT Module Based on the Power Chip-on-Chip 3-D Concept

Marchesini, Jean-Louis, Jeannin, Pierre-Olivier, Avenas, Yvan, Delaine, Johan, Buttay, Cyril, Riva, Raphael

Journal:

IEEE Transactions on Industry Applications

Year:

2017

Language:

english

File:

PDF, 718 KB

english, 2017

37

[IEEE 2014 20th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC) - London (2014.9.24-2014.9.26)] 20th International Workshop on Thermal Investigations of ICs and Systems - Experimental investigation on heat transfer enhancements in laminar flow with ferrofluids — Application to power electronics cooling

Cherief, Wahid, Wu, Martin, Avenas, Yvan, Ferrouillat, Sebastien, Jossic, Laurent, Lebouc, Afef, Berard, Jean, Petit, Mickael

Year:

2014

Language:

english

File:

PDF, 615 KB

english, 2014

38

[IEEE 2020 22nd European Conference on Power Electronics and Applications (EPE'20 ECCE Europe) - Lyon, France (2020.9.7-2020.9.11)] 2020 22nd European Conference on Power Electronics and Applications (EPE'20 ECCE Europe) - Implementation of TAPIR Switching Cells with Integrated Direct Air-Cooling for SiC Power Devices

Bikinga, Wendpanga Fadel, Alkama, Kouceila, Mezrag, Bachir, Guichon, Jean Michel, Avenas, Yvan

Year:

2020

File:

PDF, 887 KB

2020

39

Condition Monitoring: A Decade of Proposed Techniques

Avenas, Yvan, Dupont, Laurent, Baker, Nick, Zara, Henri, Barruel, Franck

Journal:

IEEE Industrial Electronics Magazine

Year:

2015

Language:

english

File:

PDF, 3.19 MB

english, 2015

40

Reliability Assessment of Multistate Degraded Systems: An Application to Power Electronic Systems

Samavatian, Vahid, Imaneini, Hossein, Avenas, Yvan

Journal:

IEEE Transactions on Power Electronics

Year:

2019

Language:

english

File:

PDF, 1.11 MB

english, 2019

41

[IEEE 2019 IEEE Energy Conversion Congress and Exposition (ECCE) - Baltimore, MD, USA (2019.9.29-2019.10.3)] 2019 IEEE Energy Conversion Congress and Exposition (ECCE) - Teaching how to characterize and implement high speed power devices for tomorrow's engineers

Schanen, Jean-Luc, Hanna, R., Chazal, H., Avenas, Yvan, Sarrazin, Benoit, Freitas, Caio, Bikinga, Wendpanga, Derbey, A., Flury, S., Dumas, F., Lefranc, P.

Year:

2019

File:

PDF, 1.58 MB

2019

42

Effect of the magnetic field direction on forced convection heat transfer enhancements in ferrofluids

Cherief, Wahid, Avenas, Yvan, Ferrouillat, Sébastien, Kedous-Lebouc, Afef, Jossic, Laurent, Berard, Jean, Petit, Mickael, Razek, Adel

Journal:

The European Physical Journal Applied Physics

Year:

2015

Language:

english

File:

PDF, 1.18 MB

english, 2015

43

Comparison of Junction Temperature Evaluations in a Power IGBT Module Using an IR Camera and Three Thermosensitive Electrical Parameters

Dupont, Laurent, Avenas, Yvan, Jeannin, Pierre-Olivier

Journal:

IEEE Transactions on Industry Applications

Year:

2013

Language:

english

File:

PDF, 2.28 MB

english, 2013

44

Improved Reliability of Power Modules: A Review of Online Junction Temperature Measurement Methods

Baker, Nick, Liserre, Marco, Dupont, Laurent, Avenas, Yvan

Journal:

IEEE Industrial Electronics Magazine

Year:

2014

Language:

english

File:

PDF, 2.76 MB

english, 2014

45

A method for accelerated ageing tests of power modules for photovoltaic inverters considering the inverter mission profiles

Dbeiss, Mouhannad, Avenas, Yvan, Zara, Henri, Dupont, Laurent

Journal:

IEEE Transactions on Power Electronics

Year:

2019

Language:

english

File:

PDF, 7 KB

english, 2019

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